. Böhringer, A. V. Krishnamoorthy, E, M. Chow; IE
. Böhringer, A. V. Krishnamoorthy, E, M. Chow; IE
of component sizes assembled on a single board incre
type of interconnection within a printed
SMTnet Express, July 10, 2014, Subscribers: 22902, Members: Companies: 13928, Users: 36450 Fatigue Damage Behavior of a Surface-mount Electronic Package Under Different Cyclic Applied Loads. Ren Huai-Hui, Wang Xi-Shu - Wind Power Engineer