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Laser Solder Reflow: A Process Solution, Part I

SMTnet Express - July 8, 2021

An Experimental and Computational Study of the Current Carrying Capacity of High Performance PWB Interconnections

An Experimental and Computational Study of the Current Carrying Capacity of High Performance PWB Interconnections

SMTnet Express - May 29, 2014

SMTnet Express - May 29, 2014

Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures

Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures More and more chip packages need

Optimizing Thermal & Mechanical Performance in PCBs

Imbedded Component/Die Technology (IC/DT®)

Imbedded Component/Die Technology (IC/DT®) News   Forums   SMT Equipment   Company Directory Calendar   Career Center   Advertising   About   FREE Company Listing! Imbedded Component/Die Technology (IC/DT®) STI has developed a patented

Imbedded Component/Die Technology (IC/DT®)

Imbedded Component/Die Technology (IC/DT®) News   Forums   SMT Equipment   Company Directory Calendar   Career Center   Advertising   About   FREE Company Listing! Imbedded Component/Die Technology (IC/DT®) STI has developed a patented