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Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures

Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures More and more chip packages need

SMT Express, Volume 5, Issue No. 12 - from SMTnet.com

IPC Printed Circuits Expo APEX

SMTnet Express - January 31, 2019

SMTnet Express - February 18, 2021

The Environmental Cost of Green

The Environmental Cost of Green

SMT Express, Volume 2, Issue No. 8 - from SMTnet.com

SMTnet Express - May 4, 2017

An Experimental and Computational Study of the Current Carrying Capacity of High Performance PWB Interconnections