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A High Performance and Cost Effective Molded Array Package Substrate

A High Performance and Cost Effective Molded Array Package Substrate A High Performance and Cost Effective Molded Array Package Substrate In this article we present both a relatively new and innovative family of packages that is suitable

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Broadband Printing a A Paradigm

Broadband Printing a A Paradigm

An Experimental and Computational Study of the Current Carrying Capacity of High Performance PWB Interconnections

An Experimental and Computational Study of the Current Carrying Capacity of High Performance PWB Interconnections

3D IC Development Needs Innovative Socket Solution

Productronica 2007 Special Show Report

Strategies for Designing Microwave Multilayer Printed Circuit Boards Using Stripline Structures

Pin in Paste Stencil Design for Notebook Mainboard