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Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures

Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures More and more chip packages need

Laser Solder Reflow: A Process Solution, Part I

Thermal Residue Fingerprinting: A Revolutionary Approach to Develop a Selective Cleaning Solution

An Experimental and Computational Study of the Current Carrying Capacity of High Performance PWB Interconnections

Economical aluminum substrates make light work of visible LED circuits…

Economical aluminum substrates make light work of visible LED circuits…

An Experimental and Computational Study of the Current Carrying Capacity of High Performance PWB Interconnections

Controlling Copper Build Up in Automatic Soldering Equipment Using Lead-Free Solder

Controlling Copper Build Up in Automatic Soldering Equipment Using Lead-Free Solder

A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing