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01005 Assembly, the AOI route to optimizing yield

Joule Heating Effects on the Current Carrying Capacity of an Organic Substrate for Flip-Chip Applications

Defluxing Déjà vu

Strength of Lead-free BGA Spheres in High Speed Loading

Pin in Paste Stencil Design for Notebook Mainboard

Enterprise-wide Supplier Quality Management: The Big Payoff for Global SPC

Integrated Offset Placement in Electronics Assembly Equipment The Answer for Solder Paste Misalignment

Integrated Offset Placement in Electronics Assembly Equipment The Answer for Solder Paste Misalignment

Method for Automated Nondestructive Analysis of Flip Chip Underfill

Method for Automated Nondestructive Analysis of Flip Chip Underfill

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