1009 kester solder wire expiration results

SMTnet Express - June 16, 2022

SMTnet Express - May 18, 2017

SMTnet Express, May 18, 2017, Subscribers: 30,472, Companies: 10,597, Users: 23,256 How to Use the Right Flux for the Selective Soldering Application Bruno Tolla Ph.D, Denis Jean, Xiang Wei Ph.D; Kester The selective soldering application requires

Strength of Lead-free BGA Spheres in High Speed Loading

Inclusion Voiding in Gull Wing Solder Joints

Inclusion Voiding in Gull Wing Solder Joints SMTnet Express August 30, 2012, Subscribers: 25432, Members: Companies: 8960, Users: 33565 Inclusion Voiding in Gull Wing Solder Joints First published in the 2012 IPC APEX EXPO technical conference

SMTnet Express - July 27, 2017

SMTnet Express - December 29, 2016

SMTnet Express, December 29, 2016, Subscribers: 30,326, Companies: 15,062, Users: 41,660 Partially-Activated Flux Residue Impacts on Electronic Assembly Reliabilities Yanrong Shi, Ph.D., Kyle Loomis, Jennifer Allen, Bruno Tolla, Ph.D.; Kester

SMTnet Express - July 20, 2017

SMTnet Express, July 20, 2017, Subscribers: 30,612, Companies: 10,637, Users: 23,528 Reactivity Of No-Clean Flux Residues Trapped Under Bottom Terminated Components Bruno Tolla, Ph.D., Jennifer Allen, Kyle Loomis - Kester Corporation , Mike

Thermal Spot Curing of Adhesives with Photonic Energy; a novel fiber delivery method of radiant heating to accelerate the polymerization of thermally active adhesives

Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures

Evaluation of Laminates in Pb-free HASL Process and Pb-free Assembly Environment