Express Newsletter: koh young spi defect codes (Page 14 of 51)

SMTnet Express - October 28, 2021

SMTnet Express, October 28, 2021, Subscribers: 26,544, Companies: 11,461, Users: 26,907 Cracks: The Hidden Defect Cracks in ceramic chip capacitors can be introduced at any process step during surface mount assembly. Thermal shock

Discover New Technologies, Processes, Equipment and Solutions at IPC APEX EXPO 2012

Discover New Technologies, Processes, Equipment and Solutions at IPC APEX EXPO 2012 Discover New Technologies, Processes, Equipment and Solutions Printed Electronics, Defect Clinic and William Shatner Highlight IPC APEX EXPO 2012 The world

Solder Paste Inspection Technologies: 2D-3D Correlation

Solder Paste Inspection Technologies: 2D-3D Correlation Solder Paste Inspection Technologies: 2D-3D Correlation It is understood that the solder paste printing process presents far more opportunities for defects than any of the other individual


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