Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
Processing and Troubleshooting SMT, BGA, CSP and Flip Chip
Impact of Reflowing A Pb-free Solder Alloy Using A Tin/Lead Solder Alloy Reflow Profile On Solder Joint Integrity If you don't see images, please visit online version at #Application.SmtNet.baseURL#/express/ The Impact of Reflowing A Pb-free
SMTnet Express, January 30, 2014, Subscribers: 26500, Members: Companies: 13561, Users: 35693 Going Lead Free With Vapor Phase Soldering - Lead Free Is Still a Challenge For Major Industries. by Andreas Thumm; IBL-Löttechnik GmbH As of today
(Flex) BGA Using a Polyimide Tape Substrate Trent
SMTnet Express, December 19, 2013, Subscribers: 26421, Members: Companies: 13524, Users: 35538 Mixed Metals Impact on Reliability by Rick Gunn; Nextek With the adoption of RoHS and implementation of Lead Free solders a major concern is how
SMTnet Express, February 18, 2016, Subscribers: 24,125, Companies: 14,990, Users: 39,958 Sample Preparation For Mitigating Tin Whiskers In Alternative Lead-Free Alloys Mehran Maalekian, Karl Seelig, Timothy O'Neill; AIM Solder As lead-free alloys
