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Optimizing Flip Chip Substrate Layout for Assembly Optimizing Flip Chip Substrate Layout for Assembly High-density flip chip applications are commonly limited by the available substrate technologies. Accordingly, considerable design efforts
Production Line Dynamics: What Count Is What Actually Comes Out Of Your Line Production Line Dynamics: What Count Is What Actually Comes Out Of Your Line In high-volume production, it is the price of the end product that matters. Purchasing
