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Optimizing Flip Chip Substrate Layout for Assembly Optimizing Flip Chip Substrate Layout for Assembly High-density flip chip applications are commonly limited by the available substrate technologies. Accordingly, considerable design efforts
Article Return to Front Page Internet Marketing for th
SMT Express, Issue No. 6 - from SMTnet.com Volume 1, Issue No. 6 Monday, November 22, 1999 Featured Article Return to Front Page Internet Marketing for the Electronics Industry by Cunli Jia and Keith Luke A note from Cunli: Over the past four
