Solder Materials Science Gets Small as Miniaturization Challenges Old Rules Solder Materials Science Gets Small as Miniaturization Challenges Old Rules Though designing much smaller packages presents its own unique set of hurdles (a topic
toward miniaturization. When these assemblies ar
to the limits of its potential. Miniaturization is
Are Separate Solder Flip-Chip Bonders Still Required? Are Separate Solder Flip-Chip Bonders Still Required? Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process
