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Express Newsletter: mpm up2000hie
A NEW PARADIGM FOR DESIGN THROUGH MANUFACTURE
The Surface Finish Effect on the Creep Corrosion in PCB
An Investigation of Whisker Growth on Tin Coated Wire and Braid
Corrosion Resistance of Different PCB Surface Finishes in Harsh Environments
Overcoming Logistic, Economic and Technical Challenges to Implementing Functional Test in High Mix / High Volume Production Environments
Void Detection in Large Solder Joints of Integrated Power Electronics
Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish
SMTnet Express January 31 - 2013, Subscribers: 26152
SMTnet Express February 22 - 2013, Subscribers: 26196
SMTnet Express March 7 - 2013, Subscribers: 26214
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[3/19] Robust Reliability Testing For Drop-on-Demand Jet Printing
[3/12] Filling of Microvias and Through Holes by Electrolytic Copper Plating ��� Current Status and Future Outlook
[2/27] Dispensing EMI Shielding Materials: An Alternative to Sputtering
[2/20] Coat-and-Print Patterning of Silver Nanowires for Flexible and Transparent Electronics
[2/13] Size Matters - The Effects of Solder Powder Size on Solder Paste Performance
[2/06] Accurately Capturing System-Level Failure of Solder Joints
[1/30] Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum
[1/23] Analysis of Inspection of DPA Test Requirements Applied To Flip Chip Technologies
[1/16] Ultra-Thin Chips For High-Performance Flexible Electronics
[1/09] Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms
[1/02] Temperature Cycling and Fatigue in Electronics
[12/27] A Life Prediction Model of Multilayered PTH Based on Fatigue Mechanism
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