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Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints.

A NEW PARADIGM FOR DESIGN THROUGH MANUFACTURE

A NEW PARADIGM FOR DESIGN THROUGH MANUFACTURE SMTnet Express April 20, 2012, Subscribers: 25095, Members: Companies: 8859, Users: 33020 A New Paradigm For Design Through Manufacture Presented at IPC Apex 2012 by: Michael Ford; Valor

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IPC APEX EXPO 2011 Deals a Full House in Vegas

Connector Models - Are They Any Good?

circuit board (PCB) materials (copper finish, dielectric

Metal Microchannel Lamination Using Surface Mount Adhesives for Low-Temperature Heat Exchangers

The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array

The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array SMTnet Express June 22, 2012, Subscribers: 25283, Members: Companies: 8903, Users: 33267