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Low Force Placement Solution For Delicate and Low IO Flip Chip Assemblies

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SMT Express, Volume 4, Issue No. 5 - from SMTnet.com

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Startling results from reliability testing

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Influence of Nanoparticles, Low Melting Point (LMP) Fillers, and Conducting Polymers on Electrical, Mechanical, and Reliability Performance of Micro-Filled Conducting Adhesives for Z-Axis Interconnections.

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