987 nonwet solder ddue to via in pad results

SMT Express, Volume 3, Issue No. 6 - from SMTnet.com

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Can You Afford Not To Improve in 2009?

Can You Afford Not To Improve in 2009?

SMTnet Express - July 16, 2020

SMTnet Express, July 16, 2020, Subscribers: 28,512, Companies: 11,045, Users: 25,964 Via In Pad - Conductive Fill or Non-Conductive Fill? Credits: Advanced Circuits In the early 2000s the first fine-pitch ball grid array devices became popular

SMT Express, Issue No. 5 - from SMTnet.com

HASL - WHAT A HASSLE, or HASL'd AGAIN.

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com

SMT Express, Volume 2, Issue No. 9 - from SMTnet.com

SMT Express, Volume 3, Issue No. 2 - from SMTnet.com