SMTnet Express, February 28, 2019, Subscribers: 31,699, Companies: 10,717, Users: 25,786 Evaluation, Selection and Qualification of Replacement Reworkable Underfill Materials Credits: Northrop Grumman Corporation A study was performed
Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
4 Vreeland Rd.
Florham Park, NJ USA
Phone: 973-377-6800
