Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components With PCB complexity and density increasing and also
) is currently the most popular near eutectic lead-fr
SMTnet Express, November 19, 2015, Subscribers: 23,763, Members: Companies: 14,760, Users: 39,366 HALT Testing of Backward Soldered BGAs on a Military Product B. Gumpert, B. Fox, L. Woody; Lockheed Martin Corporation The move to lead free (Pb
SMTnet Express, February 12, 2015, Subscribers: 22,336, Members: Companies: 14,215, Users: 37,692 Evaluating the Mechanical Reliability of Ball Grid Array (BGA) Flexible Surface-Mount Electronics Packaging under Isothermal Ageing Sabuj Mallik
winsouce.jpg)
.gif)
