1124 packaging electronic controls results

Effects of an Appropriate PCB Layout and Soldering Nozzle Design on Quality and Cost Structure in Selective Soldering Processes

3D IC Development Needs Innovative Socket Solution

SMT Express, Volume 3, Issue No. 6 - from SMTnet.com

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SMTnet Express - June 12, 2014

SMTnet Express, June 12, 2014, Subscribers: 22834, Members: Companies: 13899, Users: 36331 Instrumentation for Studying Real-time Popcorn Effect in Surface Mount Packages during Solder Reflow Arijit Roy; World Academy of Science, Engineering

SMT Express, Volume 2, Issue No. 12 - from SMTnet.com

SMTnet Express - March 12, 2015

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Minimizing Voiding In QFN Packages Using Solder Preforms

Minimizing Voiding In QFN Packages Using Solder Preforms SMTnet Express July 27, 2012, Subscribers: 25333, Members: Companies: 8933, Users: 33366 Minimizing Voiding In QFN Packages Using Solder Preforms First published in the 2012 IPC APEX EXPO

SMTnet Express - September 21, 2017

SMTnet Express, September 21, 2017, Subscribers: 30,827, Companies: 10,729, Users: 23,835 2.5D and 3D Semiconductor Package Technology: Evolution and Innovation Vern Solberg; Vern Solberg - Solberg Technical Consulting The electronics industry