Express Newsletter: pad design (Page 16 of 109)

HASL - WHAT A HASSLE, or HASL'd AGAIN.

HASL - WHAT A HASSLE, or HASL'd AGAIN. If you don't see the images, please visit online version at #Application.SmtNet.baseURL#/express/ Featured Article HASL - WHAT A HASSLE, or HASL'd AGAIN. Proof Of Design MoonMan This article updates

Head-in-Pillow BGA Defects

Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint


pad design searches for Companies, Equipment, Machines, Suppliers & Information

SMT feeders

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Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
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Voidless Reflow Soldering

Reflow Soldering 101 Training Course
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High Throughput Reflow Oven
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Private label coffee for your company - your logo & message on each bag!