Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures More and more chip packages need
SMTnet Express, November 7, 2013, Subscribers: 26366, Members: Companies: 13484, Users: 35379 Setting Up a Conformal Coating Facility by Dr Lee Hitchens; SCH Technologies . The set up of a turnkey conformal coating production line
importance. Pick & place machines have a life of
