SMTnet Express, January 23, 2020, Subscribers: 33,753, Companies: 10,965, Users: 25,546 Analysis of Inspection of DPA Test Requirements Applied To Flip Chip Technologies Credits: ALTER TECHNOLOGY Flip chip assembly techniques bring a wide range
Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend
