AllSurplus announces Panasonic NPM-W P&P Auction ☀ November 11–23, 2021 SMTnet Express, November 11, 2021, Subscribers: 26,497, Companies: 11,460, Users: 26,919 Understanding the Cleaning Process for Automatic Stencil Printers
SMTnet Express, July 2, 2020, Subscribers: 28,589, Companies: 11,034, Users: 25,930 A PROCEDURE TO DETERMINE HEAD-IN-PILLOW DEFECT AND ANALYSIS OF CONTRIBUTING FACTORS Credits: Cookson Electronics Head-in-Pillow (HIP) defects are a growing concern
Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
