948 pcb silver never oxidation shelf life results

SMT Express, Volume 3, Issue No. 3 - from SMTnet.com

index.cfm

SMTnet Express - March 06, 2014

SMTnet Express - August 1, 2014

Organic Flip Chip Packages for Use in Military and Aerospace Applications

Influence of Nanoparticles, Low Melting Point (LMP) Fillers, and Conducting Polymers on Electrical, Mechanical, and Reliability Performance of Micro-Filled Conducting Adhesives for Z-Axis Interconnections.

Conforming To a Higher Standard of Reliability

Conforming To a Higher Standard of Reliability Conforming To a Higher Standard of Reliability An electronic product's reliability has the potential to make or break its manufacturer and can be life-threatening in many safety critical

Conforming To a Higher Standard of Reliability

Conforming To a Higher Standard of Reliability Conforming To a Higher Standard of Reliability An electronic product's reliability has the potential to make or break its manufacturer and can be life-threatening in many safety critical

Advanced Thermal Interface Materials for Enhanced Flip Chip BGA

Package Converter Compliments Chip Obsolescence