SMTnet Express, January 2, 2014, Subscribers: 26448, Members: Companies: 13543, Users: 35577 Thermal Shock and Drop Test Performance of Lead-free Assemblies with No-Underfill and Corner-Underfill by Bankeem Chheda, S. Manian Ramkumar, Ph
Drop Shock Reliability of Lead-Free Alloys Effect of Micro-Additives News Forums Equipment Mart Company Directory Event's Calendar Career Center Advertising Drop Shock Reliability of Lead-Free Alloys Effect of Micro-Additives The drop shock
Optimizing Thermal & Mechanical Performance in PCBs Optimizing thermal and mechanical performance in PCBs Engineers are always striving to make a lighter, faster and stronger PCB. In order to achieve their designs, engineers must turn
IPC is the trade association for the printed wiring board and electronics assembly industries.
Training Provider / Events Organizer / Association / Non-Profit
3000 Lakeside Drive, 309 S
Bannockburn, IL USA
Phone: 847-615-7100