24 preforms results

Minimizing Voiding In QFN Packages Using Solder Preforms

Minimizing Voiding In QFN Packages Using Solder Preforms SMTnet Express July 27, 2012, Subscribers: 25333, Members: Companies: 8933, Users: 33366 Minimizing Voiding In QFN Packages Using Solder Preforms First published in the 2012 IPC APEX EXPO

SMTnet Express - April 15, 2021

SMT Express, Volume 3, Issue No. 8 - from SMTnet.com

SMT Express, Volume 2, Issue No. 5 - from SMTnet.com

Head-in-Pillow BGA Defects

Stencil Design using Regression

Quantitative Evaluation of New SMT Stencil Materials

Hermetically Sealed SMD Tantalum Capacitors

A Unified CAD-PLM Architecture for Improving Electronics Design Productivity through Automation, Collaboration, and Cloud Computing

SMTnet Express - August 8, 2019

SMTnet Express, August 8, 2019, Subscribers: 32,214, Companies: 10,853, Users: 25,321 Novel Approach to Void Reduction Using Microflux Coated Solder Preforms for QFN/BTC Packages that Generate Heat Credits: Alpha Assembly Solutions The requirement