Express Newsletter: prepreg thermal conductivity (Page 1 of 41)

SMTnet Express - May 4, 2017

SMTnet Express, May 4, 2017, Subscribers: 30,444, Companies: 10,591, Users: 23,216 Development of a Consistent and Reliable Thermal Conductivity Measurement Method, Adapted to Typical Composite Materials Used in the PCB Industry Francois

SMTnet Express - February 27, 2014

SMTnet Express, February 27, 2014, Subscribers: 22818, Members: Companies: 13775, Users: 35799 A Novel High Thermal Conductive Underfill For Flip Chip Appliation. Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced Materials, LLC. Silicon dioxide

Influence of Nanoparticles, Low Melting Point (LMP) Fillers, and Conducting Polymers on Electrical, Mechanical, and Reliability Performance of Micro-Filled Conducting Adhesives for Z-Axis Interconnections.

Influence of Nanoparticles, Low Melting Point (LMP) Fillers, and Conducting Polymers on Electrical, Mechanical, and Reliability Performance of Micro-Filled Conducting Adhesives for Z-Axis Interconnections. Influence of Nanoparticles, Low Melting

SMTnet Express - Octomer 15, 2020

SMTnet Express, Octomer 15, 2020, Subscribers: 28,116 , Companies: 11,144, Users: 26,166 Fracture Toughness Of Thermally Conductive Adhesives Credits: Henkel Electronic Materials Thermally conductive adhesives provide many advantages

  1 2 3 4 5 6 7 8 9 10 Next

prepreg thermal conductivity searches for Companies, Equipment, Machines, Suppliers & Information

December 2024 Auction

World's Best Reflow Oven Customizable for Unique Applications
Conductive Adhesive & Non-Conductive Adhesive Dispensing

Smt Feeder repair service centers in Europe, North, South America
High Throughput Reflow Oven

High Precision Fluid Dispensers
SMT feeders

High Throughput Reflow Oven
Win Source Online Electronic parts

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.