DOE for Process Validation Involving Numerous Assembly Materials and Test Methods DOE for Process Validation Involving Numerous Assembly Materials and Test Methods Selecting products that have been qualified by industry standards for use
SMTnet Express, July 13, 2017, Subscribers: 30,584, Companies: 10,624, Users: 23,496 Divergence in Test Results Using IPC Standard SIR and Ionic Contamination Measurements K. Tellefsen, M. Holtzer, T. Cucu, M. Liberatore, M. Schmidt - Alpha
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Stencil Printing of Small Apertures SMTnet Express October 25, 2012, Subscribers: 25748, Members: Companies: 9022, Users: 33865 Stencil Printing of Small Apertures First published in the 2012 IPC APEX EXPO technical conference proceedings
of the phase out of CFC’s and HCFC’s, standard s
IPC is the trade association for the printed wiring board and electronics assembly industries.
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