SMTnet Express, October 5, 2017, Subscribers: 30,900, Companies: 10,753, Users: 23,894 Intermetallic Compounds In Solar Cell Interconnections Including Lead-Free, Low Melting Point Solders Torsten Geipel, Achim Kraft, Ulrich Eitner - ISE , Monja
finish that is used for both tin-lead and lead-free s
Defect Free QFN Assembly Defect Free QFN Assembly The problem with soldering QFN packages is that they float, skew and tilt on the 'domed' melted solder during the SMT re-flow process. This floating, skewing and/or tilting will lead to solder
SMTnet Express, January 2, 2014, Subscribers: 26448, Members: Companies: 13543, Users: 35577 Thermal Shock and Drop Test Performance of Lead-free Assemblies with No-Underfill and Corner-Underfill by Bankeem Chheda, S. Manian Ramkumar, Ph
SMTnet Express, March 06, 2014, Subscribers: 22524, Members: Companies: 13810, Users: 35835 Investigation and Development of Tin-Lead and Lead-Free Solder Pastes to Reduce the Head-In-Pillow Component Soldering Defect. Jasbir Bath, Roberto Garcia
SMTnet Express, February 18, 2016, Subscribers: 24,125, Companies: 14,990, Users: 39,958 Sample Preparation For Mitigating Tin Whiskers In Alternative Lead-Free Alloys Mehran Maalekian, Karl Seelig, Timothy O'Neill; AIM Solder As lead-free alloys
SMTnet Express, February 18, 2016, Subscribers: 24,125, Companies: 14,990, Users: 39,958 Sample Preparation For Mitigating Tin Whiskers In Alternative Lead-Free Alloys Mehran Maalekian, Karl Seelig, Timothy O'Neill; AIM Solder As lead-free alloys