BGA Package Component Reliability After Long-Term Storage BGA Package Component Reliability After Long-Term Storage In 2008, the white paper Component Reliability After Long Term Storage was published in support of shelf life extension
SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Previous Page BGA REWORK Earl Moon Proof Of Design (POD) SOLDER PASTE APPLICATION (WHEN AND AS SPECIFIED) Select
SMTnet Express March 14, 2013, Subscribers: 26245, Members: Companies: 13310, Users: 34436 Assembly and Reliability of 1704 I/O FCBGA and FPBGAs by: Reza Ghaffarian, Ph.D.; Jet Propulsion Laboratory, California Institute of Technology Commercial-off-the-shelf
Dross and the Selective Soldering Process Dross and the Selective Soldering Process In the selective soldering process, dross can be detrimental. Dross (and I use this term to encompass all surface contamination) is created in conjunction
