1014 shelf-life raw boards results

SMT Express, Volume 2, Issue No. 9 - from SMTnet.com

BGA Package Component Reliability After Long-Term Storage

BGA Package Component Reliability After Long-Term Storage BGA Package Component Reliability After Long-Term Storage In 2008, the white paper Component Reliability After Long Term Storage was published in support of shelf life extension

SMT Express, Issue No. 3 - from SMTnet.com

specified board, micro-stencil, part, and solder paste to

Dross and the Selective Soldering Process

Corrosion Resistance of Different PCB Surface Finishes in Harsh Environments

Strength of Lead-free BGA Spheres in High Speed Loading

Development of Ultra-Multilayer Printed Circuit Board

Development of Ultra-Multilayer Printed Circuit Board Development of Ultra-Multilayer Printed Circuit Board This article introduces the technical development that went in to realizing an 80-layer ultra-multilayer printed circuit board, which meets

3D ICs With TSVs - Design Challenges And Requirements

3D ICs With TSVs - Design Challenges And Requirements Heat Management in Printed Circuit Boards This report discusses the significance of heat management in the design of printed circuit boards (PCB).After an introduction into the basics of PCBs

Solder Materials Science Gets Small as Miniaturization Challenges Old Rules

What cannot be cleaned in a stencil cleaner