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Express Newsletter: silicone (Page 3 of 8)
A Novel Local Search Integer-Programming-Based Heuristic for PCB Assembly on Collect-and-Place Machines
Using Flexible Circuits as an Electronic Interconnection... Do's and Don'ts
New Methods of Testing PCB Traces Capacity and Fusing
An Investigation of Whisker Growth on Tin Coated Wire and Braid
Corrosion Resistance of Different PCB Surface Finishes in Harsh Environments
Effects of Tin and Copper Nanotexturization on Tin Whisker Formation
Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints
Reliability of BGA Solder Joints after Re-Balling Process
SMTnet Express - November 14, 2013
SMTnet Express - November 21, 2013
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[3/19] Robust Reliability Testing For Drop-on-Demand Jet Printing
[3/12] Filling of Microvias and Through Holes by Electrolytic Copper Plating ��� Current Status and Future Outlook
[2/27] Dispensing EMI Shielding Materials: An Alternative to Sputtering
[2/20] Coat-and-Print Patterning of Silver Nanowires for Flexible and Transparent Electronics
[2/13] Size Matters - The Effects of Solder Powder Size on Solder Paste Performance
[2/06] Accurately Capturing System-Level Failure of Solder Joints
[1/30] Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum
[1/23] Analysis of Inspection of DPA Test Requirements Applied To Flip Chip Technologies
[1/16] Ultra-Thin Chips For High-Performance Flexible Electronics
[1/09] Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms
[1/02] Temperature Cycling and Fatigue in Electronics
[12/27] A Life Prediction Model of Multilayered PTH Based on Fatigue Mechanism
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