191 soft limits results

BGA Package Component Reliability After Long-Term Storage

for leaded packages beyond a self-imposed two-year limit. T

Advanced Thermal Interface Materials for Enhanced Flip Chip BGA

Developing an effective, fast-curing, environmentally sound conformal coating

Screening for Counterfeit Electronic Components

DOE for Process Validation Involving Numerous Assembly Materials and Test Methods

Stencil Design using Regression

The Reliability Challenges of QFN Packaging

Validity of the IPC R.O.S.E. Method 2.3.25 Researched

3D IC Development Needs Innovative Socket Solution

3D IC Development Needs Innovative Socket Solution 3D IC Development Needs Innovative Socket Solution Evolution from cell phones with only a base-band processor and limited memory to today's high-end phones with an additional applications

A High Performance and Cost Effective Molded Array Package Substrate