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SMT Express, Volume 4, Issue No. 12 - from SMTnet.com Volume 4, Issue No. 12 Thursday, December 19, 2002 Featured Article The Ways to Win Hearts and Minds Reprinted with permission from The Lean Manufacturing Advisor, Web Edition, July 2002
Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
Effects of an Appropriate PCB Layout and Soldering Nozzle Design on Quality and Cost Structure in Selective Soldering Processes If you don't see images, please visit online version at: http://www.smtnet.com/express/ Effects
Prototyping Your New Electronic Product Idea News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Prototyping Your New Electronic Product Idea Innovative Circuits, Inc. Jim
Surface Insulation Resistance Testing. Results of Independent Testing for Best Inc. BGA Stencil Repair Rework Samples Solder Paste Reattachment If you don't see the images, please visit online version at #Application
