SMTnet Express May 9, 2013, Subscribers: 26129, Members: Companies: 13373, Users: 34687 Impact of Dust on Printed Circuit Assembly Reliability by: Bo Song, Michael H. Azarian, Michael G. Pecht; CALCE Atmospheric dust consists of solids suspended
SMTnet Express, February 17, 2022, Subscribers: 25,920, Companies: 11,522, Users: 27,065 Impact of Dust on Printed Circuit Assembly Reliability Atmospheric dust consists of solids suspended in air. Dust is well known for its
SnAgCuBi and SnAgCuBiSb solder joint properties investigations SnAgCuBi and SnAgCuBiSb solder joint properties investigations This study investigates the technological properties of quaternary or quinary alloys made by addition Bi or Bi and Sb
