SMTnet Express, December 7, 2016, Subscribers: 27,507, Companies: 15,035, Users: 41,441 Understanding the Effect of Process Changes and Flux Chemistry on Mid-Chip Solder Balling Katherine Wilkerson, Ian J. Wilding, Michael Carter, Daniel Buckland
Solder Paste Inspection Technologies: 2D-3D Correlation Solder Paste Inspection Technologies: 2D-3D Correlation It is understood that the solder paste printing process presents far more opportunities for defects than any of the other individual
SMTnet Express, June 11, 2015, Subscribers: 22,861, Members: Companies: 14,392 , Users: 38,338 Solder Paste Stencil Design for Optimal QFN Yield and Reliability B. Gumpert; Lockheed Martin Corporation The use of bottom terminated components (BTC
SMTnet Express, April 28, 2022, Subscribers: 25,631, Companies: 11,565, Users: 27,194 The Effects of Temperature and Solute Diffusion on Volume Change in Sn-Bi Solder Alloys The different rates of thermal expansion of the many
SMTnet Express, October 30, 2014, Subscribers: 23456, Members: Companies: 14075, Users: 37030 Solder Joint Reliability Under Realistic Service Conditions. P. Borgesen, S. Hamasha, M. Obaidat, V. Raghavan, X. Dai; Binghamton University, M. Meilunas
