654 thermal pad both sides results

SMT Express, Volume 3, Issue No. 6 - from SMTnet.com

Modelling of Thermal Stresses in Printed Circuit Boards

Modelling of Thermal Stresses in Printed Circuit Boards Modelling of Thermal Stresses in Printed Circuit Boards Results of FEM modelling of thermal stress analysis in printed circuit boards are given in the article. It is shown that thermal

SMT Express, Volume 2, Issue No. 1 - from SMTnet.com

SMT Express, Issue No. 2 - from SMTnet.com

Advanced Thermal Interface Materials for Enhanced Flip Chip BGA

Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend

A New (Better) Approach to Tin Whisker Mitigation

Detection of Bare PCB Defects by Image Subtraction Method using Machine Vision

BGA Package Component Reliability After Long-Term Storage

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com

Accurate Quantitative Physics-of-Failure Approach to Integrated Circuit Reliability