Failure due to board flex cracks persists as the do
SMTnet Express, May 4, 2017, Subscribers: 30,444, Companies: 10,591, Users: 23,216 Development of a Consistent and Reliable Thermal Conductivity Measurement Method, Adapted to Typical Composite Materials Used in the PCB Industry Francois
Modelling of Thermal Stresses in Printed Circuit Boards Modelling of Thermal Stresses in Printed Circuit Boards Results of FEM modelling of thermal stress analysis in printed circuit boards are given in the article. It is shown that thermal
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