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Minimizing Voiding In QFN Packages Using Solder Preforms

Minimizing Voiding In QFN Packages Using Solder Preforms SMTnet Express July 27, 2012, Subscribers: 25333, Members: Companies: 8933, Users: 33366 Minimizing Voiding In QFN Packages Using Solder Preforms First published in the 2012 IPC APEX EXPO

SMTnet Express - August 20, 2015

SMTnet Express, August 20, 2015, Subscribers: 23,363, Members: Companies: 14,574, Users: 38,793 Implementing Robust Bead Probe Test Processes into Standard Pb-Free Assembly John McMahon P.Eng, Tom Blaszczyk, Peter Barber; Celestica Corporation

SMTnet Express - June 9, 2022

SMTnet Express, June 9, 2022, Subscribers: 25,475, Companies: 11,577, Users: 27,278 █  Electronics Manufacturing Technical Articles Understanding the Cleaning Process for Automatic Stencil Printers The automatic stencil wiper - first


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The Branford Group
The Branford Group

A global industrial auction and valuation business with extensive experience in SMT, PCB Assembly & Manufacturing, Test, Semiconductor and other Electronics Machinery & Equipment.

Manufacturer / Equipment Dealer / Broker / Auctions

896 Main Street
Branford, CT USA

Phone: 203-488-7020

PCB Handling Machine with CE

Wave Soldering 101 Training Course
Selective Soldering Nozzles

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Voidless Reflow Soldering

World's Best Reflow Oven Customizable for Unique Applications
High Throughput Reflow Oven

We offer SMT Nozzles, feeders and spare parts globally. Find out more
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Electronic Solutions R3

Thermal Transfer Materials.