714 universal instruments genesis model: 4988a results

SMTnet Express - June 12, 2014

SMTnet Express, June 12, 2014, Subscribers: 22834, Members: Companies: 13899, Users: 36331 Instrumentation for Studying Real-time Popcorn Effect in Surface Mount Packages during Solder Reflow Arijit Roy; World Academy of Science, Engineering

SMTnet Express - June 19, 2014

SMTnet Express - September 10, 2015

SMTnet Express - July 25, 2019

SMTnet Express - August 1, 2019

SMTnet Express - February 20, 2020

Modelling of Thermal Stresses in Printed Circuit Boards

Modelling of Thermal Stresses in Printed Circuit Boards Modelling of Thermal Stresses in Printed Circuit Boards Results of FEM modelling of thermal stress analysis in printed circuit boards are given in the article. It is shown that thermal

SMTnet Express - April 16, 2020

SMTnet Express - July 12, 2018

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