517 voids on qfn thermal pad results

SMTnet Express - June 11, 2015

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SMTnet Express, July 25, 2019, Subscribers: 32,181, Companies: 10,840, Users: 24,976 Voiding Performance with Solder Pastes Containing Modified SAC Alloys for Automotive Applications in Bottom Terminated Component Assemblies Credits: Indium

Assembly Process Variables Voiding At A Thermal Interface

Assembly Process Variables Voiding At A Thermal Interface News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Effects of Assembly Process Variables On Voiding At A Thermal

Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components

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A High Performance and Cost Effective Molded Array Package Substrate

SMT Express, Volume 2, Issue No. 9 - from SMTnet.com

SMT Express, Issue No. 3 - from SMTnet.com

SMT Express, Issue No. 2 - from SMTnet.com

SMTnet Express - August 17, 2017

SMTnet Express, August 17, 2017, Subscribers: 30,720, Companies: 10,649, Users: 23,665 The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability Richard Coyle, Richard Popowich, Charmaine Johnson - Nokia Bell

Mass Analysis Of The Components Separated From Printed Circuit Boards.