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Thermal Spot Curing of Adhesives with Photonic Energy; a novel fiber delivery method of radiant heating to accelerate the polymerization of thermally active adhesives

SMTnet Express - July 27, 2017

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SMTnet Express, December 29, 2016, Subscribers: 30,326, Companies: 15,062, Users: 41,660 Partially-Activated Flux Residue Impacts on Electronic Assembly Reliabilities Yanrong Shi, Ph.D., Kyle Loomis, Jennifer Allen, Bruno Tolla, Ph.D.; Kester

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SMTnet Express, May 18, 2017, Subscribers: 30,472, Companies: 10,597, Users: 23,256 How to Use the Right Flux for the Selective Soldering Application Bruno Tolla Ph.D, Denis Jean, Xiang Wei Ph.D; Kester The selective soldering application requires

Developing a Reliable Lead-free SMT Assembly Process

Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler Level

Level Kester, Inc. Credit/Source: Peter Biocca, C

Optimizing Flip Chip Substrate Layout for Assembly

IPC Printed Circuits Expo APEX

The Proximity of Microvias to PTHs And Its Impact On The Reliability

SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control