SMTnet Express, January 18, 2018, Subscribers: 31,180, Companies: 10,857, Users: 24,296 Fine Pitch Cu Pillar with Bond on Lead (BOL) Assembly Challenges for High Performance Flip Chip Package Nokibul Islam, Vinayak Pandey, KyungOe Kim; STATS Chip
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Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages Shedding Light on Machine Vision For effective machine vision, the first step in devising a vision system should be the lighting.This paper reviews important criteria for setting
