SMTnet Express, June 26, 2014, Subscribers: 22868, Members: Companies: 13912, Users: 36398 Enhancing Mechanical Shock Performance Using Edgebond Technology Steven Perng, Tae-Kyu Lee, and Cherif Guirguis; Cisco Systems , Edward S. Ibe; Zymet
SMTnet Express, April 17, 2014, Subscribers: 22675, Members: Companies: 13858, Users: 36080 A Novel Low Temperature Fast Flow And Fast Cure Reworkable Underfill Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced Materials, LLC. In order to meet
SMT Express, Issue No. 4 - from SMTnet.com Volume 1, Issue No. 4 Tuesday, September 14, 1999 Featured Article Return to Front Page Book Review by Brian Ellis Title: An Engineer's Handbook of Encapsulation and Underfill Technology Author
SMTnet Express, February 27, 2014, Subscribers: 22818, Members: Companies: 13775, Users: 35799 A Novel High Thermal Conductive Underfill For Flip Chip Appliation. Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced Materials, LLC. Silicon dioxide
winsouce.jpg)