Parts & Supplies | Circuit Board Assembly Products
1). FR-4 Material 2). 2 layer, 1.2mm thick 3). 5 oz copper weight. 4). LPI Green solder mask/White silk screen 5). Immersion gold over nickle
Parts & Supplies | Circuit Board Assembly Products
1). FR-4 Material 2). 2 layer, 1.2mm thick 3). 1 oz copper weight. 4). LPI Green solder mask/White silk screen 5). Gold finger 40 microinch, bevelled. 6). HASL + Gold finger, ENIG + gold finger 7). Larg volum, punch contour.
Parts & Supplies | Circuit Board Assembly Products
1). 100*85mm, FR-4 Tg170/ Polyimide 2). 4 layer count rigid/2 layer flex 3). 1.0mm thick rigid/0.15mm thick flex 4). 1 oz each layer 5). Green LPI solder mask/white ident 6). Immersion gold
Parts & Supplies | Circuit Board Assembly Products
1). 80 *190mm/2up, FR-4 2). 6 layers at 1.4mm thick 3). 35 μm copper weight 4). Green solder mask LPI/White legend 5). ENIG surface finish 6). Blind via from Layer 1 to layer 2 7). Via in pad plugged conductive resin
Parts & Supplies | Circuit Board Assembly Products
1) 190*130mm/10up, FR-4, Tg 135, CTI 175-225V 2) Dielectric constant(Er): 4.4-5.2 3) 2 layers, 1.6mm thick, 1 oz 4) Min. hole size: 0.3mm 5) Min. track/space: 4/4 mils 6) LPI Solder mask/White legend 7) Fiducial mark, tooling strips, mounting holes
Parts & Supplies | Circuit Board Assembly Products
1) 160*100mm, FR-4 CTI ≥ 600V 2) 8 layer impedance control 3) Copper weight(finished inner/outer): 1 oz 4) LPI Green mask/white silk 5) Min hole 0.19mm, 5/3 track/gap 6) 1.6mm +/-10% thick 7) Immersiong gold over nickel
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