Career Center - Resumes: bga 3500 (Page 1 of 1)

Board Assembly and Packaging Specialist

Career Center | Flower Mound, Texas USA | Engineering,Management,Production,Quality Control,Research and Development,Technical Support

 SMT and THT Soldering Process Optimization  Working knowledge of MPM Screen Printers, Fuji and Siemens Placement Equipment, BTU, ERSA and Vitronics Reflow Ovens, Camalot 3500 Underfill Dispense Machine, SEHO and Electrovert Wave Soldering Systems

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