Career Center - Resumes: underfill for bga (Page 1 of 1)

BankeemChheda-Resume

Career Center | Rochester, New York USA | Engineering

I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research

12 Years experience in Equipment, Manufacturing and Technical Support.

Career Center | , | Engineering,Technical Support

COMPETENCIES & SKILLS : Proficient in SMT chip Mounters and IC/Flip chip Placers like Assembleon, Panasonic, Yamaha & etc. Experienced in handling Screen Printers like Minami, Dek, Panasonic and semi-automatic Printers. Expert in Camalot

PCBA ENGINEERING MANAGER

Career Center | , | Engineering,Production,Quality Control

SMT EXPERT WITH DOE ,DFM AND LEAN SKILLS

  1  

underfill for bga searches for Companies, Equipment, Machines, Suppliers & Information

SMT feeders

World's Best Reflow Oven Customizable for Unique Applications
Pillarhouse USA for handload Selective Soldering Needs

Training online, at your facility, or at one of our worldwide training centers"
best pcb reflow oven

Component Placement 101 Training Course