Videos: 0.2mm diameter (Page 1 of 1)

MPM MOMENTUM+/M201908

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Substrate processing: Maximum substrate size (XxY): 609.6mmx508mm(24”x20”) For circuit boards larger than 20”, special fixtures are required Minimum substrate size (XxY): 50.8mmx50.8mm(2”x2”)

Qinyi Electronics Co.,Ltd

Dyfenco Solder Wire

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Product name: Halogen Free Lead Free Solder Wire Product code: E9650-HF961 Alloy composition: Sn/Ag3.0/Cu0.5 Diameter: 0.2mm, 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm Packing: 500g/reel, 1kg/reel (10kg/box) Price: Contact us for best price Features:

Dyfenco International Co., Ltd.

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0.2mm diameter searches for Companies, Equipment, Machines, Suppliers & Information

SMT feeders

Reflow Soldering 101 Training Course
High Throughput Reflow Oven

Training online, at your facility, or at one of our worldwide training centers"
pressure curing ovens

High Throughput Reflow Oven
Electronic Solutions R3

500+ original new CF081CR CN081CR FEEDER in stock