E1330717000 ZST SHUTTER GUIDE E1330721000 COVER FUR E133072100A COVER FUR (ST) E133072100B COVER FUR (ZN) E1330725000 COVER FUR E13307250B0 COVER (UPPER) SUB ASM. E1330725FA0 COVER (UPPER) ASM.(STB) E1331706000 FEEDING CAM PLATE E1331
03010187S01 PE-UHMW FOIL 42,5 x 0,5 mm x 40m/Rol 03010315S01 Maglev MWA120-0064 03010326S01 PE-UHMW GLUE TAPE 50 x 0,3mm x 16,5m 03010329S01 HOLDER FEEDER SLIDE SPRING/X8 03010352-01 Tension spring d=0,63* D=5,6* Lo=23,3 03010415
600mm Penumatic V-groove PCB Cutter Linear Blades PCB Separator Penumatic V-groove PCB Cutter Description: In order to improve the output of printed circuit board (PCB) manufacturing and the linear speed of surface mount (SMT), the printed circ
Metal Board V-cut PCB Depaneling Machine Guillotine PCB Cutter Features: 1. Less stress ,high cutting quality 2. Suitable for cutting all kinds of PCB material, even for Aluminum and copper material PCBs. 3. Security:the cutting opening is 2mm t
03010415S01 Tension Spring Z-051GX 03010444S02 Hose, Placement Circuit 3*6*125 03010445S01 Hose, Query Placem.Circ.,6-Nozzle Head 03010482-01 LINE FILTER 03010496-01 CABLE FOR MOTOR MTC 2 03010513-01 CONTACTOR 3RT1015-1JB42 03010565-01 CALIBRAT
Siemens HS60 parameters Placement head type: 12-nozzle collection and placement head Number of cantilevers: 4 Theoretical mounting rate: 60000cph Component range: 0.6mm x 0.3mm (0201) to 18.7mm x 18.7mm The highest placement accuracy (4 sigma):
Siemens placement machine D4I, SIPLACE D4i high-speed placement machine Model description: 1. Number of cantilevers: 4 2. Number of placement heads: 4 3. IPC speed: 57.000cph 4. SIPLACE benchmark evaluation: 66.000cph 5. Theoretical speed: 81.50
Siemens placement machine D4I, SIPLACE D4i high-speed placement machine Model description: 1. Number of cantilevers: 4 2. Number of placement heads: 4 3. IPC speed: 57.000cph 4. SIPLACE benchmark evaluation: 66.000cph 5. Theoretical speed: 81.50
PCB Depaneling Router ML-CS818 This device is suitable for various small multi-connected PCB sub-boards such as mobile phones, tablet computers, automotive electronics, GPS, boards, etc. The enlarged size is suitable for the sub-board processing of
