MIRTEC is pleased to announce that after an extensive evaluation BOSCH has selected MIRTEC’s 3D AOI Technology as the best solution to meet their ongoing quality initiatives.
The evaluation process was exceedingly detailed and included a
High accuracy inspection guarantees reliable defect detection of die bonds, ball-to-wedge, wedge-to-wedge and security bonds
Inspection of minimal wire thicknesses up to 15 µm
Reliable differentiation of wire courses
Recognition of defective bon
